代碼
002008
應用領域：
1、應用於PCBA、FPCA、LCP、軟硬結合板、覆蓋膜、SIP封裝晶片等材料的精密切割、挖槽；
2、適用於攝像頭模組、封裝晶片等產品的精密加工，在手機數碼產品、可穿戴設備、汽車電子等領域均有應用。
![[x]](/public/static/modules/cms/images/closeimgfz1.svg)
![[LOGO]](/public/uploads/images/20240220/49570243d3c046b2eeccf28c6d993b0e.png)
![[LOGO]](/public/uploads/images/20240220/6b9eb6be44012f52f2dd2acf6382137f.png)
![[→]](/public/static/modules/cms/images/jiguangimgfz1.svg)
![[→]](/public/static/modules/cms/images/zixuniconim2.svg)
![[x]](/public/static/modules/cms/images/closeicon1.png)
![[↓]](/public/static/modules/cms/images/xiangxiaimgfaz1-1.svg)
![[首頁]](/public/static/modules/cms/images/homeicon1.svg)
![[圖標]](/public/uploads/images/20220613/fc1c83eb02c951ce168aaebde4fd8205.svg)
![[↑]](/public/static/modules/cms/images/rtxiangshangimg1.svg)